Treatment device, plating apparatus including the same, conveying device, and treatment method
AssigneeEbara Corporation
InventorsKenya ITO, Hirohiko UEDA
Life of this patent
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AssigneeEbara Corporation
InventorsKenya ITO, Hirohiko UEDA
Estimating the term…
To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.
A treatment device comprising:
A treatment method comprising:
A conveying device which conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane, the device comprising:
Dependencies are inferred from the claim text.