Method for manufacturing copper foil with rough surface in plating tank and its product

A method for manufacturing a copper foil with a rough surface in a plating tank, comprising a step of:

• causing an electrolyte solution to flow between a cathode and an anode of a plating tank with a current density of 5 ASF-40 ASF to form a copper foil with a rough surface on the cathode, wherein
• the rough surface does not contact the cathode, comprises dense nodules of single copper crystals and has an arithmetic mean roughness (Ra) of 0.20 μm-1.5 μm and a ten-point mean roughness (Rz) of 0.5 μm-8.0 μm;
• and
• the electrolyte solution comprises chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) having a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound having the formula (1) (1 ppm-60 ppm)
• R1—S—CnH2n—R2 (1),
• wherein
• R1 is —H, —C7H4NS, —CH4N2, —S—CnH2n—R2 or —CnH2n—R2;
• R2 is —SO3—, —PO4— or —COO—;
• and
• n is an integer of 2-10.