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US 2019/0375655 A1Published application
Negative thermal expansion material and composite material
AssigneeNational University Corporation Nagoya University
InventorsKoshi Takenaka, Yoshihiko Okamoto, Yasunori Yokoyama, Naoyuki Katayama
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Abstract
A negative thermal expansion material according to an embodiment is represented by a general formula (1): Cu2-xRxV2O7 (R is at least one element selected from Zn, Ga, and Fe) and includes an oxide sintered compact whose linear expansion coefficient is −10 ppm/K or less.
Claims9
A negative thermal expansion material that is represented by a general formula (1):
- Cu2-xRxV2O7 (R is at least one element selected from Zn, Ga, and Fe) and that comprises an oxide sintered compact whose linear expansion coefficient is −10 ppm/K or less.
A negative thermal expansion material that is represented by a general formula (2):
- Cu2V2-xMoxO7 and that comprises an oxide sintered compact whose linear expansion coefficient is −10 ppm/K or less.
Dependencies are inferred from the claim text.