Sensor package and method of producing the sensor package

A method of producing a sensor package, comprising:

• providing a carrier including electric conductors;
• fastening a dummy die or interposer on the carrier;
• providing an ASIC device comprising an integrated sensor element, and
• fastening the ASIC device to the dummy die or interposer.

A sensor package, comprising:

• a carrier including electric conductors;
• an ASIC device;
• a sensor element integrated in the ASIC device;
• a dummy die or interposer arranged between the carrier and the ASIC device;
• the dummy die or interposer being fastened to the carrier;
• the ASIC device being fastened to the dummy die or interposer;
• and
• the ASIC device laterally overhanging the dummy die or interposer by at least 100 μm.