Multi-layer piezoelectric substrate with heat dissipation

A surface acoustic wave device with a temperature compensated multi-layer substrate with heat dissipation, the surface acoustic wave device comprising:

• a support substrate;
• a piezoelectric layer;
• an interdigital transducer electrode on the piezoelectric layer;
• a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave device, the thermally conductive layer having a higher thermal conductive than the support substrate, the thermally conductive layer being disposed between the support substrate and the piezoelectric layer, and the thermally conductive layer having a thickness that is greater than 10 nanometers and less than a thickness of the piezoelectric layer;
• and
• a temperature compensating layer having a positive temperature coefficient of frequency, the temperature compensating layer and the interdigital transducer electrode being disposed on opposite sides of the piezoelectric layer.

A radio frequency module comprising:

• a radio frequency switch configured to pass a radio frequency signal;
• a surface acoustic wave filter configured to filter the radio frequency signal, the surface acoustic wave filter including a surface acoustic wave resonator configured to generate a surface acoustic wave having a wavelength of λ, the surface acoustic wave resonator including support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator, the thermally conductive layer being disposed between the quartz substrate and the piezoelectric layer, and the thermally conductive layer having a thickness in a range between 10 nanometers and 0.03 λ;
• and
• a package enclosing the surface acoustic wave filter and the radio frequency switch.