Component Carrier With Only Partially Filled Thermal Through-Hole

A method of manufacturing a component carrier, wherein the method comprises:

• forming a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
• forming a through-hole extending through the at least one electrically insulating layer structure;
• filling only part of the through-hole with highly thermally conductive material so that a recess is formed which is not filled with the highly thermally conductive material,
• wherein the recess extends at least from an outer face of the at least one electrically insulating layer structure into the through-hole;
• wherein the filling is carried out so that a diameter, B, of the recess at a level of the outer face of the at least one electrically insulating layer structure and a width, A, of a web of the highly thermally conductive material at the level of the outer face of the at least one electrically insulating layer structure fulfill the condition B>A.