Thinned flexible polyimide substrate and method for manufacturing the same
AssigneeMicrocosm Technology Co., Ltd.
InventorTang-Chieh Huang
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Abstract
The present invention provides a thinned flexible polyimide substrate and a method for manufacturing the same. The thinned flexible polyimide substrate comprises a polyimide resin, a conductor layer, and a polyimide insulating layer. The polyimide resin has a linear thermal expansion coefficient of less than 40 ppm/K. The conductor layer is formed of a plurality of stacked metal nanoparticles having pores therebetween, and each of the pores has a size between 0.1 μm and 1 μm. A portion of the polyimide resin fills into the pores. The polyimide insulating layer is formed of the polyimide resin coated on the conductor layer.
Claims10
1-7. (canceled)
A method for manufacturing a thinned flexible polyimide substrate, comprising:
- (a) providing a carrier;
- (b) applying a plurality of metal nanoparticles onto the carrier to form a conductor layer, wherein a plurality of pores are formed between the stacked metal nanoparticles, and each of the pores has a size of 0.1 μm to 1 μm;
- (c) covering the conductor layer of the step (b) with a polyimide resin such that a portion of the polyimide resin penetrates and fills into the pores, and the other portion of the polyimide resin forms a polyimide insulating layer on the conductor layer;
- and
- (d) separating the carrier from the conductor layer of step (c) to form the thinned flexible polyimide substrate.
(canceled)
Dependencies are inferred from the claim text.