Metal-clad laminate, circuit board, and multilayer circuit board
AssigneeMurata Manufacturing Co., Ltd.
InventorsKazuhiko Ohashi, Sunao Fukutake, Takeshi Eda
Life of this patent
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Abstract
A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.
Claims20
A metal-clad laminate comprising:
- a liquid crystal polymer film;
- an adhesive layer disposed on the liquid crystal polymer film, with the adhesive layer having:
- a thickness of 0.5 μm or more and 4.0 μm or less,
- a dynamic magnification of at least 1.15, and
- a loss tangent of 0.16 or less at a strain of 0.06% under periodic strain at 1 Hz, and;
- and
- a metal foil disposed on the adhesive layer and having a surface in contact with the adhesive layer having roughness height of 0.4 μm or less.
A circuit board comprising:
- a metal-clad laminate that includes;
- a liquid crystal polymer film;
- an adhesive layer disposed on the liquid crystal polymer film, with the adhesive layer having:
- a thickness of 0.5 μm or more and 4.0 μm or less,
- a dynamic magnification of at least 1.15, and
- a loss tangent of 0.16 or less at a strain of 0.06% under periodic strain at 1 Hz, and;
- and
- a metal foil disposed on the adhesive layer and having a surface in contact with the adhesive layer having roughness height of 0.4 μm or less;
- and
- a circuit disposed in the metal foil of the metal-clad laminate.
An electronic component comprising:
- a multilayer circuit board, with each circuit board including:
- a metal-clad laminate that includes a liquid crystal polymer film, an adhesive layer, and a metal foil stacked on the adhesive layer,
- wherein the adhesive layer includes a thickness of 0.5 μm or more and 4.0 μm or less, a dynamic magnification of at least 1.15, and a loss tangent of 0.16 or less at a strain of 0.06% under periodic strain at 1 Hz,
- wherein the metal foil has a surface in contact with the adhesive layer with roughness height of 0.4 or less, and
- wherein a circuit is disposed in the metal foil of the metal-clad laminate;
- and
- a mother board with the multilayer circuit board mounted on the mother board.
Dependencies are inferred from the claim text.