Wiring board and method for manufacturing same
AssigneeNEC Corporation
InventorKazuhiro KASHIWAKURA
Life of this patent
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Abstract
The present invention addresses the problem of reducing a delay time difference between signals transmitted by means of a differential signal wires in a wiring board having glass cloth. A wiring board comprises: an insulating layer which includes fibers having a planar shape with translational symmetry with respect to two linearly independent, predetermined translational vectors, and a layer-like insulating material encapsulating the fibers; and through-holes formed at the starting and end points of a vector which is the sum of substantially integral multiples of the two translational vectors and which has the starting point on the planar shape.
Claims20
A wiring board comprising:
- an insulating layer including a fabric having a planar shape that is translationally symmetric with respect to predetermined two linearly independent translation vectors and a layered insulating material encapsulating the fabric;
- and
- through-holes formed at starting and end points of a vector that is a sum of substantially integral multiples of each of the two translation vectors and has a starting point on the planar shape.
A wiring board manufacturing method comprising:
- forming an insulating layer by disposing a fabric that has a planar shape that is translationally symmetric with respect to predetermined two linearly independent translation vectors and encapsulating the fabric by a layered insulating material;
- and
- forming through-holes at starting and end points of a vector that is a sum of substantially integral multiples of each of the two translation vectors and has a starting point on the planar shape.
Dependencies are inferred from the claim text.