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US 2019/0357346 A1Published application
Heat dissipation substrate, method for preparing same, application of same, and electronic device
AssigneeBYD Company Limited
InventorsJunlan LIAN, Hongye LIN
Life of this patent
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Abstract
The present disclosure A heat dissipation substrate includes: a metal-ceramic composite board, where the metal-ceramic composite board is a metal layer wrapping a ceramic body; a metal oxide layer integrated with the metal layer and formed on an outer surface of the metal layer; and a conductive layer formed on at least a part of an outer surface of the metal oxide layer, where a conductive trace is formed on the conductive layer, and is used to connect with and bear a chip.
Claims20
A heat dissipation substrate, comprising:
- a metal-ceramic composite board, wherein the metal-ceramic composite board is a metal layer wrapping a ceramic body;
- a metal oxide layer integrated with the metal layer and formed on an outer surface of the metal layer;
- and
- a conductive layer formed on at least a part of an outer surface of the metal oxide layer, wherein a conductive trace is formed on the conductive layer, and is configured to connect with a chip and bear a chip.
1 more element
Dependencies are inferred from the claim text.