Systems and methods for reducing noise in microphones

A microphone assembly, comprising:

• a substrate;
• an enclosure disposed on the substrate, a port defined in one of the substrate or the enclosure;
• an acoustic transducer configured to generate an electrical signal responsive to acoustic activity, the acoustic transducer comprising a membrane separating a front volume from a back volume of the microphone assembly, the front volume being in fluidic communication with the port;
• an integrated circuit electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer;
• and
• a thermal barrier layer positioned on at least one interior surface of a boundary defining the back volume, the thermal barrier layer formulated to have a thermal conductivity less than a thermal conductivity of air.

A method of forming a microphone assembly, comprising:

• providing a substrate;
• providing an enclosure, a port defined in one of the substrate or the enclosure;
• positioning an acoustic transducer on one of the substrate or the enclosure, the acoustic transducer comprising a membrane, the acoustic transducer configured to generate an electrical signal responsive to acoustic activity;
• electrically coupling an integrated circuit to the acoustic transducer;
• disposing the enclosure on the substrate such that the membrane separates a space between the substrate and the enclosure into a front volume being in fluidic communication with the port, and a back volume;
• and
• filling the back volume with a first gas having a thermal conductivity lower than a thermal conductivity of air.