Method for manufacturing vapor deposition mask and method for vapor deposition of organic light-emittng material

A method for vapor deposition of organic light-emitting materials, comprising:

• providing a main film, the main film comprising a plastic film;
• forming at least one electrostatic protection film on the main film;
• fixing the main film together with the at least one electrostatic protection film to a frame, the at least one electrostatic protection film positioned on at least one of a surface of the main film away from the frame and a surface of the main film adjacent to the frame;
• etching the plastic film to form a plurality of openings each extending through the plastic film;
• and
• removing the at least one electrostatic protection film;
• providing a substrate, the substrate positioned on a surface of the main film;
• providing an evaporation source comprising light-emitting materials, the evaporation source positioned on a side of the main film away from the substrate;
• heating the evaporation source make the light-emitting materials to pass through the plurality of openings and deposit on the substrate;
• wherein the main film further comprises a metal layer stacked on the plastic film, the metal layer partially covers the plastic film;
• wherein the metal layer does not cover any of the plurality of openings;
• the vapor deposition method of organic light-emitting materials further comprises:
• providing a magnet on a side of the substrate away from the main film before heating the evaporation source.

A method of manufacturing a vapor deposition mask, comprising:

• providing a main film, the main film comprising a plastic film and a metal layer stacked on the plastic film, the metal layer partially covering the plastic film;
• forming at least one electrostatic protection film on the main film, wherein the at least one electrostatic protection film comprises a first electrostatic protection film covering a surface of the plastic film away from the metal layer and a second electrostatic protection film covering a surface of the metal layer away from plastic layer and a surface of the plastic film having the metal layer;
• fixing the main film together with the at least one electrostatic protection film to a frame, the frame covering a peripheral portion of the metal layer;
• etching the plastic film to form a plurality of openings each extending through the plastic film;
• and
• removing the at least one electrostatic protection film.