Multilayer circuit substrate and manufacturing method thereof

Abstract

An aspect of the invention provides a multilayer circuit substrate that has a simple configuration and is thin. The multilayer circuit substrate has a stacked multiple of substrates and a wiring pattern disposed so to be sandwiched between the stacked multiple of substrates. At least one portion of the wiring pattern is configured of a conductive material wherein conductive particles are sintered. An upper face of the wiring pattern is directly joined to the substrate positioned above the wiring pattern, a lower face of the wiring pattern is directly joined to the substrate positioned below the wiring pattern, and the stacked multiple of substrates are fixed to each other by the wiring pattern.

Dependencies are inferred from the claim text.