Light emitting diodes and methods
AssigneeCreeLED, Inc.
InventorChristopher P. Hussell
Life of this patent
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Abstract
Light emitting diode (LED) devices, methods and systems are provided. An example apparatus can include an underfill layer separate from a bonding layer. The apparatus can further include a dark encapsulating layer comprising an epoxy-molded compound which is applied using a powder-coating process. A method for providing a powder-coated encapsulation and for producing an LED panel with such an encapsulant is disclosed.
Claims41
A light emitting diode (LED) apparatus, comprising:
- a substrate;
- one or more light emitting diode (LED) disposed over the substrate;
- and
- an encapsulant layer applied after the one or more LED is disposed over the substrate, wherein the encapsulant layer comprises an underfill layer;
- wherein the encapsulant layer is disposed around the one or more LED and at least partially between the one or more LEDs and the substrate,
- wherein the one or more LED is devoid of any reflective material on a lower surface of the one or more LED facing the substrate.
A method of controlling light output, comprising
- providing a substrate and one or more light emitting diodes (LEDs) disposed over the substrate;
- applying an underfill layer after the one or more LEDs are disposed over the substrate, wherein the underfill layer is disposed at least partially between the one or more LEDs and the substrate;
- and
- controlling light output from the one or more LEDs by selectively applying a reflective underfill layer to increase light output from the one or more LEDs or applying a non-reflective or dark underfill layer to decrease light output from the one or more LEDs.
A light emitting diode (LED) apparatus, comprising:
- a substrate;
- one or more light emitting diodes (LEDs);
- and
- a powder-coated material disposed over the substrate.
A light emitting diode (LED) apparatus, comprising:
- a substrate;
- one or more light emitting diodes (LEDs);
- one or more light-transmissive layer disposed over the substrate and one or more LEDs;
- and
- one or more dark layer disposed over the one or more light-transmissive layer,
- wherein a region above the one or more LEDs is substantially or completely devoid of the one or more dark layer.
A method of producing a panel of light emitting diodes (LEDs), the method comprising:
- providing a substrate with at least one LED disposed over the substrate;
- applying one or more light-transmissive layer over the at least one LED;
- applying one or more dark layer over the light-transmissive layer;
- and
- removing at least a portion of the layers in a region above the at least one LED to expose at least a portion of the one or more light-transmissive layer.
A method of encapsulating a light emitting diode (LED) device, the method comprising:
- providing a substrate with at least one LED disposed over the substrate;
- and
- powder-coating the substrate and/or the LED with a powder using a powder spray or an electrostatic powder-coating process.
Dependencies are inferred from the claim text.