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US 2019/0355864 A1Published application
Optical transmission/reception circuit
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsAlexandre COULLOMB, Romain COFFY, Jean-Michel RIVIERE
Life of this patent
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Abstract
A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.
Claims20
A device comprising:
- a substrate;
- and
- a first optoelectronic chip buried in the substrate.
A method of manufacturing a device, the method comprising:
- forming a first optoelectronic chip with a first optical transduction region;
- and
- burying the first optoelectronic chip in a substrate.
A device comprising:
- a substrate including a first internal cavity;
- and
- a first optoelectronic chip positioned in the first internal cavity and at least partially covered on each of four sides by respective portions of the substrate.
Dependencies are inferred from the claim text.