FINFETS with Wrap-Around Silicide and Method Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuo-Cheng Chiang, Ching-Wei Tsai, Chi-Wen Liu, Chih-Hao Wang, Ying-Keung Leung
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuo-Cheng Chiang, Ching-Wei Tsai, Chi-Wen Liu, Chih-Hao Wang, Ying-Keung Leung
Estimating the term…
A device includes isolation regions extending into a semiconductor substrate, with a substrate strip between opposite portions of the isolation regions having a first width. A source/drain region has a portion overlapping the substrate strip, wherein an upper portion of the source/drain region has a second width greater than the first width. The upper portion of the source/drain region has substantially vertical sidewalls. A source/drain silicide region has inner sidewalls contacting the vertical sidewalls of the source/drain region.
A device comprising:
A device comprising:
A device comprising:
Dependencies are inferred from the claim text.