Semiconductor device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorJong Su Kim
Life of this patent
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Abstract
A semiconductor device includes a substrate, and a first source/drain region formed on the substrate. The semiconductor device further includes a channel formed on the first source/drain region, and a second source/drain region formed on the channel. The semiconductor device also includes a gate electrode formed on an external surface of the channel, and a metal pad formed on the substrate. The height of an upper surface of the metal pad is the same as the length of an upper surface of the gate electrode.
Claims15
A method for manufacturing a semiconductor device, the method comprising:
- forming a first source/drain region on a substrate;
- forming a channel on the first source/drain region;
- forming a second source/drain region on the channel;
- forming a gate electrode on an outer surface of the channel;
- and
- forming a metal pad on the substrate;
- wherein a height of an upper surface of the metal pad is the same as a height of an upper surface of the gate electrode.
A method for manufacturing a semiconductor device, the method comprising:
- forming a first spacer layer, a silicide layer, and a stack comprising a first insulating layer and a vertical channel on a substrate;
- forming a gate metal layer on the first spacer layer, the silicide layer, and the stack;
- forming a second spacer layer over the gate metal layer and the stack;
- forming an organic planarization layer (OPL) over the second spacer layer;
- removing a portion of the OPL, the second spacer layer, and the gate metal layer to expose a portion of the first spacer layer;
- removing remaining portion of the OPL;
- forming a third spacer layer over the second spacer layer, the gate metal layer, and the stack;
- forming a second insulating layer over the second spacer layer;
- removing the first insulating layer of the stack;
- forming an upper source/drain region on the vertical channel;
- forming a fourth spacer layer on a second source/drain region;
- forming a third insulating layer on the second source/drain region;
- forming a first and second apertures on the silicide layer and the first spacer layer simultaneously;
- and
- forming a third aperture on the second source/drain region;
- wherein a height of the gate metal layer on the silicide layer is the same as a height of the gate metal layer on the first spacer layer.
A method of constructing an integrated circuit, the method comprising:
- forming a silicide layer, a first spacer layer, and a stack including a plurality of layers on a substrate, respectively, with the stack surrounded by the first spacer layer, and with the silicide layer and the first spacer layer positioned right next to each other;
- forming a metal layer on the first spacer layer and the silicide layer;
- forming a photoresist layer on the metal layer;
- patterning the photoresist layer;
- removing a first portion of the metal layer formed on a first portion of the first spacer layer that is positioned between the silicide layer and the stack;
- forming a second portion of the metal layer on the silicide layer and a third portion of the metal layer on a second portion of the first spacer layer, with a thickness of the second portion of the metal layer being the same as the thickness of the third portion;
- and
- manufacturing the integrated circuit including the second and third portions of the metal layers.
Dependencies are inferred from the claim text.