Methods of improving adhesion of photoresist in a staircase structure and methods of forming a staircase structure

A method of improving adhesion between a spin-on dielectric material and conductive or insulating structures, comprising:

• forming a slot through tiers of conductive structures and insulating structures;
• selectively forming recesses in the conductive structures or in the insulating structures;
• and
• forming a spin-on dielectric material adjacent the tiers and within the slot and within the recesses.

A method of forming a staircase structure, comprising:

• forming a slot through at least a portion of alternating conductive structures and insulating structures on a material;
• removing portions of the conductive structures or of the insulating structures to form recesses in the conductive structures or in the insulating structures;
• forming a photoresist adjacent the alternating conductive structures and insulating structures and within the slot;
• and
• conducting repeated trim acts of the photoresist to form stairs of the staircase structure.

A method of forming a staircase structure, comprising:

• forming a slot through tiers of conductive structures and insulating structures;
• selectively forming recesses in the conductive structures;
• forming a photoresist over the tiers and within the slot and recesses;
• and
• conducting repeated trim acts of the photoresist to form stairs of the staircase structure.