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US 2019/0355700 A1Published application
Techniques for windowed substrate integrated circuit packages
AssigneeIntel Corporation
InventorsAiping Tan, Bin Liu, Li Deng, Yong She, Zhicheng Ding, Mao Guo
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Abstract
Techniques for providing an integrated circuit package that avoids or eliminates x-y area and z-height compared to conventional integrated circuit packages. In certain examples, an example package can utilize a substrate with an opening and bottom side or sidewall terminations to avoid adding addition x-y substrate area or z-axis package height associated with an integrated circuit die of a stack of integrated circuit dies of the package.
Claims25
An integrated circuit (IC) package comprising:
- a substrate;
- a first integrated circuit die mounted to the substrate;
- a second integrated circuit die mounted to the first integrated circuit die and electrically connected directly to the first integrated circuit die;
- wherein the substrate includes an opening;
- and
- wherein the second integrated circuit is positioned within the opening when the first integrated circuit die is mounted to the substrate.
3 more elements
A method comprising:
- connecting a plurality of integrated circuit (IC) dies into a stack;
- mounting the stack to a top side of a substrate over an opening of the substrate;
- wire bonding the stack to terminations located on the top side of the substrate;
- and
- mounting a bottom IC die to the stack via the opening.
2 more elements
An electronic device, comprising,
- a substrate;
- a processor circuit;
- a first integrated circuit die mounted to the substrate;
- a second integrated circuit die mounted to the first integrated circuit die;
- at least one of a display device and a network interface operably coupled to the processor circuit via the substrate;
- wherein the substrate includes an opening;
- and
- wherein the second integrated circuit is positioned within the opening when the first integrated circuit die is mounted to the substrate.
5 more elements
Dependencies are inferred from the claim text.