US 2019/0355699 A1 · Methods and Systems for Adjusting Wafer Deformation During Wafer Bonding

Abstract

Embodiments of methods and systems for adjusting wafer deformation during wafer bonding are provided. The method comprises: releasing inner rings of a first wafer, and applying a first gas pressure to the inner rings of the first wafer, such that the inner rings of the first wafer are in contact with a second wafer; releasing middle rings of the first wafer, such that the middle rings of the first wafer are deformed under a second gas pressure and in contact with the second wafer; releasing inner rings of the second wafer, and applying a third gas pressure less than the first gas pressure to the inner rings of the second wafer; releasing middle rings of the second wafer; and releasing outer rings of the first wafer and releasing outer rings of the second wafer simultaneously.

Claims20

Dependent claims

A method for bonding wafers, comprising:

(i) releasing inner rings of a first wafer from a first chuck, and applying a first gas pressure to the inner rings of the first wafer, such that the inner rings of the first wafer are in contact with a second wafer;
(ii) releasing middle rings of the first wafer from the first chuck, such that the middle rings of the first wafer are deformed under a second gas pressure and in contact with the second wafer;
(iii) releasing inner rings of the second wafer from a second chuck, and applying a third gas pressure to the inner rings of the second wafer, wherein the third gas pressure is smaller than the first gas pressure;
(iv) releasing middle rings of the second wafer from the second chuck;
and
(v) releasing outer rings of the first wafer from the first chuck and releasing outer rings of the second wafer from the second chuck simultaneously.

3 more elements

A system for bonding wafers, comprising:

a wafer support module including a first chuck and a second chuck configured to support a first pair of wafers respectively;
an alignment monitoring module configured to measure positions of a plurality of bonding alignment mark pairs on the first pair of wafers;
a hardware processor configured to analyze a run-out misalignment between the first pair of wafers based on the positions of the plurality of bonding alignment mark pairs;
a wafer position adjustment module configured to adjust positions of wafer support module;
and
a wafer deformation adjustment module configured to compensate the run-out misalignment during bonding of a second pair of wafers by adjusting gas pressures between each of the second pair of wafers and the corresponding chuck.

3 more elements

Dependencies are inferred from the claim text.

Methods and Systems for Adjusting Wafer Deformation During Wafer Bonding

Life of this patent

Methods and Systems for Adjusting Wafer Deformation During Wafer Bonding

Life of this patent

Abstract

Claims20