US 2019/0355698 A1 · METHODS AND SYSTEMS FOR WAFER BONDING ALIGNMENT COMPENSATION

Abstract

Embodiments of methods and systems for wafer bonding alignment compensation are disclosed. The method comprises bonding a first pair of wafers including multiple bonding alignment mark pairs on the first pair of wafers; first analyzing a translational misalignment and a rotational misalignment between the first pair of wafers based on a measurement of at least two bonding alignment mark pairs; controlling a wafer position adjustment module to compensate for the translational misalignment and the rotational misalignment during bonding of a second pair of wafers based on the first analysis; second analyzing a mean run-out misalignment between the first pair of wafers based on a measurement of the multiple bonding alignment mark pairs; and controlling a wafer deformation adjustment module to compensate for the run-out misalignment during bonding of a third pair of wafers based on the second analysis.

Claims20

Dependent claims

A method for wafer bonding alignment compensation, comprising:

bonding a first pair of wafers including a bottom wafer and a top wafer, wherein a plurality of bonding alignment mark pairs are on the first pair of wafers, each bonding alignment mark pair includes a bottom bonding alignment mark on the bottom wafer and a top bonding alignment mark on the top wafer;
first analyzing a translational misalignment and a rotational misalignment between the first pair of wafers based on a measurement of at least two bonding alignment mark pairs;
controlling a wafer position adjustment module to compensate for the translational misalignment and the rotational misalignment during bonding of a second pair of wafers based on the first analysis;
second analyzing a mean run-out misalignment between the first pair of wafers based on a measurement of the plurality of bonding alignment mark pairs;
and
controlling a wafer deformation adjustment module to compensate for the run-out misalignment during bonding of a third pair of wafers based on the second analysis.

3 more elements

A system for bonding wafers, comprising:

a wafer support module configured to support a first pair of wafers including a plurality of bonding alignment mark pairs, wherein the first pair of wafers including a bottom wafer and a top wafer, and each bonding alignment mark pair includes a bottom bonding alignment mark on the bottom wafer and a top bonding alignment mark on the top wafer;
an alignment monitoring module configured to measure positions of the plurality of bonding alignment mark pairs;
a hardware processor configured to analyze a translational misalignment and a rotational misalignment between the first pair of wafers based on a measurement of at least two bonding alignment mark pairs, and to analyze a mean run-out misalignment between the first pair of wafers based on a measurement of the plurality of bonding alignment mark pairs;
a wafer position adjustment module configured to compensate the translational misalignment and the rotational misalignment during bonding of a second pair of wafers;
and
a wafer deformation adjustment module configured to compensate the mean run-out misalignment during bonding of a third pair of wafers.

3 more elements

Dependencies are inferred from the claim text.

Methods and systems for wafer bonding alignment compensation

Life of this patent

Methods and systems for wafer bonding alignment compensation

Life of this patent

Abstract

Claims20