Method of manufacturing integrated fan-out package

A method of manufacturing an integrated fan-out (InFO) package, comprising:

• forming a package array;
• placing a plurality of core patterns on the package array, wherein each of the plurality of core patterns comprises a plurality of cavities, and the plurality of core patterns are spaced apart from each other;
• forming a dielectric layer on the plurality of core patterns;
• forming a plurality of first conductive patches on the dielectric layer, wherein the plurality of first conductive patches are arranged corresponding to the plurality of cavities.

A method of manufacturing an integrated fan-out (InFO) package, comprising:

• forming a package array;
• forming a core layer having a plurality of cavities over the package array;
• forming a dielectric layer on the core layer;
• attaching the dielectric layer to an adhesive layer;
• attaching a plurality of first conductive patches to the adhesive layer, wherein the plurality of first conductive patches are arranged corresponding to the plurality of cavities.