Dual-interface ic card module

A method of manufacturing a dual-interface integrated circuit card module, the method comprising:

• providing a substrate having first and second opposing surfaces, with a contact pad on the first surface of the substrate;
• forming first and second recesses in the second surface of the substrate;
• placing an antenna pad into each of the first and second recesses,
• wherein the first and second recesses pass through the substrate, the antenna pads being attached to a back surface of the contact pad;
• placing an integrated circuit on the second surface of the substrate;
• forming electrical connections between the integrated circuit and the contact pad through the substrate;
• and
• forming an electrical connection between each antenna pad and a corresponding antenna connection on the integrated circuit.

A method of constructing a dual-interface integrated circuit card having aspects which correspond to claim 1, the method comprising:

• providing a card body containing an antenna, the antenna having a pair of antenna connections;
• providing a dual-interface integrated circuit card module according to claim 1;
• electrically connecting the antenna connections to the antenna pads of the module;
• and
• bonding the module to the card body.