Single-Shot Encapsulation
AssigneeSemtech Corporation
InventorsKok Khoon Ho, Jonathan Clark, John MacLeod
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar bumps while the semiconductor die remains on the carrier. The encapsulant covers an active surface of the semiconductor die between the pillar bumps.
Claims20
A semiconductor device, comprising:
- a semiconductor die;
- a pillar bump formed over the semiconductor die;
- a solder cap formed over the pillar bump;
- and
- an encapsulant deposited over the semiconductor die, pillar bump, and solder cap, wherein a surface of the encapsulant is coplanar with a surface of the solder cap and the encapsulant contacts a back surface of the semiconductor die opposite the pillar bump.
A semiconductor device, comprising:
- a first semiconductor die;
- a pillar bump formed over the first semiconductor die;
- a solder cap formed over the pillar bump;
- and
- an encapsulant deposited over the first semiconductor die, pillar bump, and solder cap, wherein the encapsulant contacts an active surface of the first semiconductor die and a back surface of the first semiconductor die opposite the active surface.
A semiconductor device, comprising:
- a semiconductor die;
- a pillar bump formed over the semiconductor die;
- a solder cap formed over the pillar bump;
- and
- an encapsulant deposited over the semiconductor die, pillar bump, and solder cap.
Dependencies are inferred from the claim text.