Package structure and fabricating method thereof

A package structure, comprising:

• a semiconductor die, the semiconductor die comprising:
• a semiconductor substrate;
• a plurality of conductive pads disposed on the semiconductor substrate;
• a plurality of conductive posts disposed on and connected to the plurality of conductive pads;
• a first connecting structure physically connects at least two of the plurality of conductive posts together, and is physically connected to at least two of the plurality of conductive pads;
• an insulating encapsulant encapsulating the semiconductor die;
• a redistribution layer disposed on the insulating encapsulant and the semiconductor die, wherein the redistribution layer is physically and electrically connected to the plurality of conductive posts and the first connecting structure;
• and
• a plurality of conductive terminals disposed on the redistribution layer.

A method of fabricating a package structure, comprising:

• forming a semiconductor die, wherein a method of forming the semiconductor die comprises:
• providing a semiconductor wafer having a semiconductor substrate;
• forming a first conductive material on the semiconductor substrate;
• pattering the first conductive material to form a plurality of conductive pads;
• forming a passivation layer over the plurality of conductive pads, and patterning the passivation layer to form at least one contact opening exposing the plurality of conductive pads;
• forming a plurality of conductive strips within the contact opening and on the plurality of conductive pads, wherein each of the plurality of conductive strips is formed with a plurality of conductive posts and a first connecting structure physically joining at least two of the plurality of conductive posts together, and the first connecting structures is physically connected to at least two of the plurality of conductive pads;
• and
• performing a wafer dicing process to cut the semiconductor wafer into a plurality of semiconductor dies;
• disposing at least one of the plurality of semiconductor dies on a carrier;
• forming an insulating encapsulant on the carrier and encapsulating the at least one of the plurality of semiconductor dies;
• forming a redistribution layer on the insulating encapsulant and the at least one of the plurality of semiconductor dies, wherein the redistribution layer is physically and electrically connected to the plurality of conductive posts and the plurality of first connecting structures;
• and
• forming a plurality of conductive terminals on the redistribution layer.