Method for fabricating the electronic component, and method for transposing a micro-element

A method for transposing at least one micro-element, comprising:

• forming at least one solder on at least one connecting electrode, wherein each connecting electrode has a first transparent conductive layer and a plurality of micrometers or nanometer particles on the first transparent conductive layer;
• lifting the at least one micro-element by using a transposing component, wherein the transposing component comprises an elastic suction head and a pump part, the elastic suction head has at least one projection separately lifting the at least one micro-element, the elastic suction head is coupled to the pump part, the pump part has at least one gas hole, the elastic suction head has at least one through hole connected to the at least one gas hole, and the through hole passes through one of the at least one projection via the surface of the elastic suction head to penetrate the other surface of the elastic suction head;
• moving the at least one micro-element on the at least one solder by using the transposing component;
• fixing the at least one micro-element on the at least one connecting electrode by using the at least one solder, wherein the plurality of the micrometers or nanometer particles of each connecting electrode are embedded in the solder;
• driving the pump part to introduce a gas to the at least one through hole;
• and
• separating the at least one micro-element from the elastic suction head while introducing the gas.