Semiconductor Device and Method of Manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Yao Chuang, Po-Hao Tsai, Shin-Puu Jeng
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Abstract
A semiconductor device and manufacturing process are provided wherein a first semiconductor device is electrically connected to redistribution structures. An antenna structure is located on an opposite side of the first semiconductor device from the redistribution structures, and electrical connections separate from the first semiconductor device connect the antenna structure to the redistribution structures.
Claims20
A semiconductor device comprising:
- redistribution structures connected to external connections;
- a first semiconductor device connected to the redistribution structures;
- an antenna substrate located on an opposite side of the first semiconductor device from the redistribution structures;
- and
- electrical connections separate from the first semiconductor device, the first semiconductor device being electrically connected to the antenna substrate through the redistribution structures and the electrical connections.
A method of manufacturing a semiconductor device, the method comprising:
- forming a redistribution structure over a carrier wafer;
- attaching a first semiconductor device to the redistribution structure;
- electrically connecting an antenna substrate to the redistribution structure, wherein the first semiconductor device is located between the antenna substrate and the redistribution structure;
- and
- removing the carrier wafer.
A method of manufacturing a semiconductor device, the method comprising:
- forming through substrate vias over a polymer layer;
- attaching a first semiconductor device to the polymer layer;
- encapsulating the through substrate vias and the first semiconductor device with an encapsulant;
- planarizing the encapsulant until the first semiconductor device, the encapsulant, and the through substrate vias are planar with each other;
- forming a redistribution structure over the encapsulant, the through substrate vias, and the first semiconductor device;
- patterning the polymer layer after the forming the redistribution structure;
- and
- bonding an antenna substrate to the through substrate vias through the polymer layer.
Dependencies are inferred from the claim text.