Package structure and manufacturing method thereof

A package structure, comprising:

• a first redistribution circuit structure;
• at least one semiconductor die, located on and electrically connected to the first redistribution circuit structure;
• a first insulating encapsulation, encapsulating the at least one semiconductor die;
• metallic patterns, located on and electrically coupled to the first redistribution circuit structure;
• and
• a second insulating encapsulation, encapsulating the metallic patterns, wherein the first redistribution circuit structure is located between the first insulating encapsulation and the second insulating encapsulation,
• wherein a sidewall of each of the metallic patterns is wrapped by the second insulating encapsulation, and a surface of each of the metallic patterns is exposed by a first side of the second insulating encapsulation.

A method of manufacturing a package structure, comprising:

• forming an antenna package, comprising:
• providing an insulating material layer;
• forming metallic patterns on the insulating material layer;
• encapsulating metallic patterns in a first insulating encapsulation;
• and
• performing a dicing process to form the antenna package, wherein a sidewall of each of the metallic patterns is covered by the first insulating encapsulation;
• forming a first redistribution circuit structure;
• disposing at least one semiconductor die on the first redistribution circuit structure, wherein the at least one semiconductor die is electrically connected to the first redistribution circuit structure;
• encapsulating the at least one semiconductor die in a second insulating encapsulation;
• and
• disposing the antenna package on the first redistribution circuit structure, wherein the first redistribution circuit structure is electrically coupled to the antenna package and located between the at least one semiconductor die and the antenna package.