Semiconductor device package and method of manufacturing the same

A semiconductor device package, comprising:

• a substrate having a top surface;
• a first coil disposed on the top surface of the substrate, the first coil including a first conductive segment;
• a dielectric layer covering the first conductive segment and the second conductive segment;
• and
• a second coil disposed on the dielectric layer, the second coil including a first conductive segment,
• wherein the first conductive segment of the first coil and the first conductive segment of the second coil overlap in a direction substantially parallel to the top surface of the substrate.

A semiconductor device package, comprising:

• a substrate having a top surface;
• a first coil disposed on the top surface of the substrate, the first coil including a plurality of conductive segments;
• a dielectric layer covering the first coil and defining a recess between two adjacent conductive segments of the first coil;
• and
• a second coil disposed on the dielectric layer, the second coil including a plurality of conductive segments,
• wherein one of the plurality of the conductive segments of the second coil is disposed within the recess.