Semiconductor structure and method for manufacturing the same

A semiconductor structure, comprising:

• a wafer comprising a crystal orientation represented by a family of Miller indices comprising <ijk>, wherein i2+j2+k2=2;
• and
• a first chip over the wafer, wherein a first edge of the first chip is arranged in a direction, and the direction is not parallel to the crystal orientation.

18-20. (canceled)

A semiconductor structure, comprising:

• a wafer comprising a crystal orientation represented by a family of Miller indices comprising <ijk>, wherein i2+j2+k2=2;
• and
• a first chip, a second chip and a third chip connected to the wafer, wherein the second chip and the third chip are disposed adjacent to different sides of the first chip, a first boundary is formed between the second chip and the first chip extending in a first direction, and a second boundary is formed between the third chip and the first chip extending in a second direction, a first included angle between the first direction and the crystal orientation is greater than 0 degree and less than 90 degrees, and a second included angle between the second direction and the crystal orientation is greater than 0 degree and less than 90 degrees.