Circuit apparatus

Abstract

A circuit apparatus according to an embodiment includes: a wiring substrate having a wiring; a first electronic component provided on the wiring substrate; a second electronic component provided on the wiring substrate, the second electronic component having a height higher than a height of the first electronic component; a sealing member provided on the wiring substrate, the sealing member covering the first electronic component and the second electronic component, a first distance between a first surface of the sealing member above the first electronic component and the wiring substrate being shorter than a second distance between a second surface of the sealing member above the second electronic component and the wiring substrate; and a conductive member provided on the sealing member, the conductive member exposing the second surface, a third distance between a third surface of the conductive member provided above the first electronic component and the wiring substrate being equal to the second distance, and a film thickness of the conductive member at the third surface being thicker than a film thickness of the conductive member at a fourth surface provided between the third surface and the second surface.

Dependencies are inferred from the claim text.