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US 2019/0355667 A1Published application
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorHeungkyu Kwon
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor package. The semiconductor package may include a substrate, a semiconductor chip on the substrate, a passive element on the substrate, a conductive structure on the substrate, and an interposer substrate on the semiconductor chip, the passive element, and the conductive structure. The interposer substrate may be electrically connected to the conductive structure. A height of the passive element may be greater than a height of the semiconductor chip.
Claims21
A semiconductor package comprising:
- a substrate;
- a semiconductor chip on the substrate;
- a passive element on the substrate, a height of the passive element being greater than a height of the semiconductor chip;
- a conductive structure on the substrate;
- and
- an interposer substrate on the semiconductor chip, the passive element, and the conductive structure,
- the interposer substrate being electrically connected to the conductive structure.
4 more elements
A semiconductor package comprising:
- a substrate;
- a semiconductor chip on an upper surface of the substrate;
- a passive element on the upper surface of the substrate;
- an interposer substrate on the semiconductor chip and the passive element;
- a conductive structure between the substrate and the interposer substrate;
- a lower solder connection portion between the substrate and the conductive structure;
- and
- an upper solder connection portion between the conductive structure and the interposer substrate.
5 more elements
A semiconductor package comprising:
- a substrate;
- a semiconductor chip on an upper surface of the substrate;
- a passive element on the upper surface of the substrate, an upper surface of the passive element being at a higher level than an upper surface of the semiconductor chip;
- a conductive structure on the substrate;
- an interposer substrate on the semiconductor chip, the passive element, and the conductive structure,
- the interposer substrate being electrically connected to the conductive structure;
- and
- a lower solder connection portion between the substrate and the conductive structure, the lower solder connection portion being connected to the substrate and the conductive structure.
5 more elements
-25. (canceled)
Dependencies are inferred from the claim text.