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US 2019/0355658 A1Published application
Interconnects with variable space mandrel cuts formed by block patterning
AssigneeGlobalfoundries Inc.
InventorsRavi Prakash Srivastava, Hui Zang, Jiehui Shu
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Abstract
Methods of fabricating an interconnect structure. A hardmask is deposited over an interlayer dielectric layer, and a block mask is formed that covers an area on the hardmask. A sacrificial layer is formed over the block mask and the hardmask, and the sacrificial layer is patterned to form a mandrel that extends across the block mask.
Claims20
A method comprising:
- depositing a hardmask over an interlayer dielectric layer;
- forming a first block mask that covers a first area on the hardmask;
- forming a sacrificial layer over the first block mask and the hardmask;
- and
- patterning the sacrificial layer to form a first mandrel that extends across the first block mask.
2 more elements
Dependencies are inferred from the claim text.