Semiconductor module and semiconductor device using the same

A semiconductor device comprising:

• a semiconductor module including:
• an insulation circuit board including a metal layer formed on a lower plane;
• a sealing resin including a rear plane, sealing the insulation circuit board so that the metal layer is exposed to the rear plane, and being urged so that an end of the rear plane is warped upward in relation to a center of the rear plane;
• and
• a cylindrical member including a first outer peripheral surface embedded in the sealing resin and including an unevenness and a second outer peripheral surface provided below the first outer peripheral surface and smoother than the first outer peripheral surface and provided such that a bottom plane of a lower end of the second outer peripheral surface is exposed from the rear plane of the sealing resin and at least a part of the second outer peripheral surface above the lower end of the second outer peripheral surface is sealed by the sealing resin and is disposed near the end of the sealing resin in relation to the insulation circuit board;
• a heat transfer material provided while being in contact with a lower plane of the metal layer of the semiconductor module;
• an external device being in contact with the heat transfer material;
• and
• a fixed member inserted through the cylindrical member and fixed to the external device.