Semiconductor device

A semiconductor device comprising:

• a semiconductor chip having an electrode;
• a conductive member including a metal base and having, on a face opposed to the electrode, a mounting portion for the semiconductor chip and a peripheral portion surrounding the mounting portion;
• a solder that is provided between the electrode and the mounting portion to connect the electrode and the conductive member;
• and
• a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder,
• wherein:
• the conductive member has, as the peripheral portion, an adhesive portion and a non-adhesive portion;
• the sealing resin body adheres to the adhesive portion;
• the non-adhesive portion is placed between the mounting portion and the adhesive portion;
• the solder does not connect with the non-adhesive portion;
• and
• the non-adhesive portion has lower adhesion to the sealing resin body than the adhesive portion;
• the adhesive portion includes a roughened portion having a continuously uneven surface;
• the conductive member includes a film on a surface of the metal base;
• the film has a metal thin film on the surface of the metal base, and an uneven oxide film that is an oxide of metal and that has a continuously uneven surface, the metal being a main component of the metal thin film;
• and
• the uneven oxide film is provided to an entire area of the adhesive portion and at least a part of the non-adhesive portion close to the adhesive portion.

A semiconductor device comprising:

• a semiconductor chip having an electrode;
• a conductive member including a metal base and having, on a face opposed to the electrode, a mounting portion for the semiconductor chip and a peripheral portion surrounding the mounting portion;
• a solder that is provided between the electrode and the mounting portion to connect the electrode and the conductive member;
• and
• a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder,
• wherein:
• the conductive member has, as the peripheral portion, an adhesive portion and a non-adhesive portion;
• the sealing resin body adheres to the adhesive portion;
• the non-adhesive portion is placed between the mounting portion and the adhesive portion;
• the solder does not connect with the non-adhesive portion;
• and
• the non-adhesive portion has lower adhesion to the sealing resin body than the adhesive portion;
• and
• only at the adhesive portion of the peripheral portion includes a resin layer to increase the adhesion to the sealing resin body.

A semiconductor device comprising:

• a semiconductor chip having an electrode;
• a conductive member including a metal base and having, on a face opposed to the electrode, a mounting portion for the semiconductor chip and a peripheral portion surrounding the mounting portion;
• a solder that is provided between the electrode and the mounting portion to connect the electrode and the conductive member;
• and
• a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder,
• wherein:
• the conductive member has, as the peripheral portion, an adhesive portion and a non-adhesive portion;
• the sealing resin body adheres to the adhesive portion;
• the non-adhesive portion is placed between the mounting portion and the adhesive portion;
• the solder does not connect with the non-adhesive portion;
• the non-adhesive portion has lower adhesion to the sealing resin body than the adhesive portion;
• the semiconductor chip has
• a first electrode, which is the electrode, on a first face side in a thickness direction, and
• a second electrode on a second face side opposite to the first face side;
• the semiconductor device further comprises a second conductive member that is disposed, causing the semiconductor chip to be sandwiched between the first conductive member as the conductive member and the second conductive member in the thickness direction, the second conductive member being electrically connected to the second electrode;
• the sealing resin body integrally seals a face of the second conductive member, the face facing the first conductive member;
• the first conductive member has, as the peripheral portion, the non-adhesive portion and a first adhesive portion that is the adhesive portion and;
• and
• the second conductive member has, on a face opposed to the first conductive member of the second conductive member, a second adhesive portion to which the sealing resin body adheres and which overlaps at least a part of the non-adhesive portion in a plan view in the thickness direction.