Semiconductor-mounted product

A semiconductor-mounted product comprising:

• a semiconductor package;
• a wiring substrate having a mounting surface on which wiring is disposed and the semiconductor package is to be mounted;
• four or more soldered portions electrically connecting the semiconductor package to the wiring;
• and
• a resin-reinforced portion that is located from the mounting surface to a side surface of each of the four or more soldered portions and is provided apart from the semiconductor package,
• wherein
• each of the four or more soldered portions has a first solder region located closer to the semiconductor package than the wiring substrate and a second solder region located closer to the wiring substrate than the semiconductor package, and
• a proportion of a void present in a polygon connecting centers of soldered portions located at outermost positions among the four or more soldered portions to a sum of the void and the resin-reinforced portion is from 10% to 99%, inclusive, in a surface that is apart from the mounting surface by ⅓ of a distance from a position most distant from the wiring of the resin-reinforced portion to the mounting surface and is parallel to the mounting surface.