Microelectronic assemblies having conductive structures with different thicknesses on a core substrate

A microelectronic assembly, comprising:

• a package substrate, the package substrate comprising:
• a core having a surface;
• and
• a first trace having a first thickness on the surface of the core;
• and
• a second trace having a second thickness on the surface of the core, wherein the second thickness is different than the first thickness;
• and
• a die coupled to the package substrate and electrically coupled to the first trace via conductive pathways in the package substrate.

A method of manufacturing a microelectronic assembly, comprising:

• depositing and patterning a first photoresist layer on a core substrate to form one or more openings;
• forming a first conductive layer in the one or more openings to form one or more conductive features having a first thickness;
• depositing and patterning a second photoresist layer on the first photoresist layer to cover one or more of the one or more openings;
• and
• forming a second conductive layer in the one or more openings not covered by the second photoresist layer to form one or more conductive features having a second thickness, wherein the second thickness is different from the first thickness.