Packages with multiple exposed pads

An apparatus comprising:

• a lead frame including:
• a first lead;
• a first pad coupled to the first lead and comprising a first recessed area and a first non-recessed area;
• a second lead;
• and
• a second pad coupled to the second lead and comprising a second recessed area and a second non-recessed area, the first and second recessed areas separated by a first gap;
• and
• a device coupled to the first and second non-recessed areas, the device separated from the first recessed area by a second gap and the device separated from the second recessed area by a third gap,
• wherein the first and second pads are exposed to an exterior of the apparatus.

A method comprising:

• fabricating a lead frame including first and second leads, a first pad coupled to the first lead and a second pad coupled to the second lead, the first and second pads separated by a gap;
• coupling a device to the first and second pads;
• and
• applying a mold compound to the lead frame and the device,
• wherein the first and second pads are exposed to an exterior of the mold compound.