Two sided bondable lead frame
OwnerDolores Babaran Milo, Ernesto Pentecostes Rafael, Jr.inventors
Life of this patent
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Abstract
A lead frame includes a first side having a first die attach pad that is bondable to a die, and a second side that has a second die attach pad that is bondable to another die. The lead frame includes multiple leads on the edges of the lead frame to connect the die. As part of a no-leads device, such as a quad flat no leads (QFN) or dual flat no-leads (DFN), one of the die attach pads is used in binding to a die, and the other die attach pad is used for thermal dissipation and mounting to a structure such as printed circuit board (PCB).
Claims20
A semiconductor package comprising:
- a lead frame comprising:
- a first side and a second side, wherein the first side includes a first die attach pad and the second side opposite to the first side includes a second die attach pad;
- a die attached to the first die attach pad via a die attach material and electrically connected to at least one of multiple leads;
- and
- multiple leads;
- and
- a molding that covers portions of the lead frame, the die attach material, and the die, wherein a portion of the second die attach pad is exposed from the package.
A semiconductor package comprising:
- a lead frame comprising:
- a first side that includes a first die attach pad bondable to a die;
- a second side that includes a second die attach pad bondable to another die;
- and
- multiple leads on the edges of the lead frame used for die connection;
- and
- encapsulation that covers the lead frame and exposes at least one of the first die attach pad or the second die attach pad and the multiple leads.
A method of fabricating a no-leads device comprising:
- etching a first side of a lead frame to form a first die attach pad;
- etching a second side of the lead frame to form a second die attach pad;
- determining which of the first die attach pad or the second die attach pad to bind a die to;
- binding the die to the die attach pad that is determined to bind the die to;
- connecting bond pads on the die to specific leads of a set of leads that are part of the lead frame;
- and
- adding a molding over portions of the lead frame and the die, wherein the set of leads and the pad that is not used to bind the die are exposed from the no-leads device.
The method of 15, wherein the etching the first die attach pad defines edges of the first die attach pad and through holes for wire connections from the bond pads of a die bound to the first die attach pad, and the etching of the second die attach pad defines edges of the second die attach pad and through holes for wire connections from the bond pads of another die bound to the second die attach pad.
The method of 15 further comprising plating and polishing the lead frame after etching the first die attach pad and the second die attach pad.
Dependencies are inferred from the claim text.