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US 2019/0355650 A1Published application
Semiconductor package with continuous lead frame
AssigneeInfineon Technologies Americas Corp.
InventorWeidong Fan
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a semiconductor die, a tab, a first lead, and a continuous lead frame. The semiconductor die includes a first terminal, a second terminal, and a third terminal. The tab is electronically coupled to the first terminal. The semiconductor die is mounted on the tab. The first lead is electronically coupled to the second terminal. The continuous lead frame is electronically coupled to the third terminal and includes a second lead and a third lead.
Claims20
A semiconductor package comprising:
- a semiconductor die comprising a first terminal, a second terminal, and a third terminal;
- a tab electronically coupled to the first terminal, wherein the semiconductor die is mounted on the tab;
- a first lead electronically coupled to the second terminal;
- and
- a continuous lead frame electronically coupled to the third terminal, the continuous lead frame comprising a second lead and a third lead.
2 more elements
A method comprising:
- mounting a semiconductor die to a tab, the semiconductor die comprising a first terminal, a second terminal, and a third terminal, wherein mounting the semiconductor die to the tab electronically couples the first terminal to the tab;
- electronically coupling the second terminal to a first lead;
- and
- electronically coupling the third terminal to a continuous lead frame, the continuous lead frame comprising a second lead and a third lead.
1 more element
A semiconductor package comprising:
- a semiconductor die comprising a first terminal, a second terminal, and a third terminal;
- a tab electronically coupled to the first terminal, wherein the semiconductor die is mounted on the tab;
- a first lead;
- one or more first wire bonds electronically coupling the second terminal to the first lead;
- a continuous lead frame comprising a lead connection region, a second lead, and a third lead;
- and
- one or more second wire bonds electronically coupling the third terminal to the lead connection region of the continuous lead frame.
4 more elements
Dependencies are inferred from the claim text.