Semiconductor device

A semiconductor device comprising:

• a first semiconductor module;
• and
• a second semiconductor module stacked with the first semiconductor module,
• wherein
• the first semiconductor module comprises:
• at least one first semiconductor element;
• a first encapsulant encapsulating the at least one first semiconductor element;
• a first power terminal electrically connected with an upper electrode of each of the at least one first semiconductor element within the first encapsulant and extending to outside of the first encapsulant;
• and
• a second power terminal electrically connected with a lower electrode of each of the at least one first semiconductor element within the first encapsulant and extending to the outside of the first encapsulant,
• the second semiconductor module comprises:
• at least one second semiconductor element;
• a second encapsulant encapsulating the at east one second semiconductor element;
• a third power terminal electrically connected with an upper electrode of each of the at least one second semiconductor element within the second encapsulant and extending to outside of the second encapsulant;
• and
• a fourth power terminal electrically connected with a lower electrode of each of the at least one second semiconductor element within the second encapsulant and extending to the outside of the second encapsulant, and
• outside the first encapsulant and the second encapsulant, the first power terminal and the fourth power terminal extend to be opposed to each other, and the second power terminal and the third power terminal extend to be opposed to each other.