Wire Bonded Package with Single Piece Exposed Heat Slug and Leads

A semiconductor device package, comprising:

• a semiconductor die;
• an encapsulant material that encapsulates the semiconductor die;
• an integrally formed electrically conductive structure that provides a die pad and a first lead for the semiconductor device package;
• a second lead that is partially encapsulated by the encapsulant material and is detached from the die pad,
• wherein the semiconductor die comprises a first terminal that faces and is electrically connected to the die pad and a second terminal facing away from the first terminal that is electrically connected to the second lead,
• wherein the first and second leads intersect with first and second opposite facing sidewalls of the encapsulant material, respectively, at locations that are vertically offset from one another
• wherein the integrally formed electrically conductive structure comprises a die attach surface and an outer surface opposite the die attach surface,
• wherein the outer surface of the integrally formed electrically conductive structure that is directly opposite from the semiconductor die is exposed from the encapsulant material,
• wherein an area of the die pad is larger than the semiconductor die, and
• wherein the semiconductor die is mounted on the die pad such that semiconductor die is completely contained within an outer periphery of the die pad.

A method of forming a semiconductor device package, the method comprising:

• providing an electrically conductive die pad comprising a die attach surface and an outer surface opposite the die attach surface;
• mounting a semiconductor die on the die attach surface;
• forming an encapsulant material that encapsulates the semiconductor die and exposes the outer surface of the die pad at an upper side of the encapsulant material;
• providing a first lead that directly contacts the die pad, extends away from a first sidewall of the encapsulant material, and bends towards a lower side of the encapsulant material that is opposite the upper side;
• and
• providing a second lead that is electrically connected to a terminal of the semiconductor die, extends away from a second sidewall of the encapsulant material that is opposite the first sidewall, and bends towards the lower side of the encapsulant material,
• wherein the first lead comprises a first lateral section that intersects the first sidewall,
• wherein the second lead comprises a second lateral section that intersects the second sidewall, and
• wherein the first and second leads are provided such that the first and second lateral sections are vertically offset from one another.