Sensor package structure

A sensor package structure, comprising:

• a substrate;
• a retaining wall disposed on the substrate and enclosing an accommodating space;
• an electronic chip arranged in the accommodating space and fixed on the substrate by flip-chip bonding;
• a bottom layer filled in the accommodating space and surrounding a lateral side of the electronic chip;
• an adhesive layer having a bottom side adhered to the electronic chip and the bottom layer, thereby entirely embedding the electronic chip in the bottom layer and the adhesive layer;
• a sensor chip having a size greater than that of the electronic chip, wherein the sensor chip has a top surface, a bottom surface, and a lateral surface that is connected to the top surface and the bottom surface;
• the bottom surface of the sensor chip is adhered to a top side of the adhesive layer;
• a light-permeable sheet arranged above the top surface of the sensor chip;
• a plurality of metal wires electrically connected to the substrate and the sensor chip;
• and
• a package body disposed on the substrate and covering a lateral side of the retaining wall and the lateral surface of the sensor chip, wherein the metal wires are entirely embedded in the package body;
• the light-permeable sheet is fixed above the sensor chip through the package body, and is partially exposed from the package body.