Heat-curable maleimide resin composition for semiconductor encapsulation and semiconductor device

Abstract

Provided are a heat-curable maleimide resin composition capable of yielding a cured product superior in tracking resistance; and a semiconductor device encapsulated by the cured product of such resin composition. The heat-curable maleimide resin composition for semiconductor encapsulation contains: (A) a maleimide compound being solid at 25° C., and having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two maleimide groups; (B) an inorganic filler; and C) a curing accelerator.

Dependencies are inferred from the claim text.