Semiconductor device and method of manufacturing semiconductor device

A semiconductor device, comprising:

• a conductor base;
• a plurality of identical semiconductor units mounted on the conductor base, each of the semiconductor units comprising a semiconductor module and a box-shaped insulating resin frame that encloses the semiconductor module;
• and
• a bus bar connecting the plurality of semiconductor units in parallel to each other,
• wherein the semiconductor module comprises:
• an insulating circuit substrate mounted on the conductor base,
• semiconductor chips mounted on the insulating circuit substrate, and
• rod-shaped terminals provided on the insulating circuit substrate and connected to the semiconductor chips, the rod-shaped terminals vertically extending upwardly away from the conductor base,
• wherein the box-shaped insulating resin frame is mounted on the conductor base so as to enclose the semiconductor module, and the conductor base in contact with a bottom of a sidewall of the insulating resin frame is a grounded portion,
• wherein each of the semiconductor units further comprises:
• a first insulating member that fills in a space defined by the insulating resin frame and the semiconductor module enclosed therein so as to seal the semiconductor module, an upper surface of the first insulating member being positioned at a level that is lower than upper end portions of the rod-shaped terminals, thereby exposing the upper end portions of the respective rod-shaped terminals from the first insulating member, the exposed upper end portions of the respective rod-shaped being connected to the bus bar;
• and
• a second insulating member that fills in an inside of the insulating resin frame on the first insulating member so as to seal and bury the upper end portions of the rod-shaped terminals that are connected to the bus bar, and
• wherein in each of the semiconductor units, one or more of an interface between the first insulating member and the second insulating member, an interface between the first insulating member and the insulating resin frame, and an interface between the second insulating member and the insulating resin frame are arranged between two adjacent ones of the rod-shaped terminals and between any of the rod-shaped terminals and the grounded portion.