Die component supply device

A die component supply device comprising:

• a wafer holding section having an elastic component holding sheet configured to hold multiple die components formed by dicing a semiconductor wafer on an upper face of the component holding sheet and a support ring configured to support a peripheral edge of the component holding sheet;
• a suction nozzle configured to pick up the die components one by one from the component holding sheet;
• an imaging camera configured to image the die component, together with the surrounding condition before being picked up, to obtain component image data, the die component being a pickup target of the suction nozzle;
• a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section;
• and
• a data processing memory section configured to collectively store, in wafer characteristic data, multiple pieces of the component image data obtained for each of the multiple die components or multiple pieces of component characteristics data obtained by performing image processing on each of the multiple pieces of component image data.