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US 2019/0355599 A1Published application
Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorTakehiro SHINDO
Life of this patent
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Abstract
There is provided a substrate processing apparatus that includes: a polygonal transfer chamber; a process chamber connected to the polygonal transfer chamber via a transfer port through which a substrate is transferred; and a transfer mechanism provided in the polygonal transfer chamber and configured to transfer the substrate between the polygonal transfer chamber and the process chamber via the transfer port, wherein the polygonal transfer chamber and the process chamber have regions overlapping each other when viewed from the top.
Claims12
A substrate processing apparatus, comprising:
- a polygonal transfer chamber;
- a process chamber connected to the polygonal transfer chamber via a transfer port through which a substrate is transferred;
- and
- a transfer mechanism provided in the polygonal transfer chamber and configured to transfer the substrate between the polygonal transfer chamber and the process chamber via the transfer port,
- wherein the polygonal transfer chamber and the process chamber have regions overlapping each other when viewed from the top.
2 more elements
Dependencies are inferred from the claim text.