Method of processing substrate and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsTakashi MOCHIZUKI, Toshiaki FUJISATO
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AssigneeTokyo Electron Limited
InventorsTakashi MOCHIZUKI, Toshiaki FUJISATO
Estimating the term…
There is provided a method of processing a substrate by a substrate processing apparatus including a substrate mounting table having a refrigerant passage and a heater, and a chiller. The method includes adjusting a temperature of the substrate mounting table to a first temperature to process the substrate; and adjusting the temperature of the substrate mounting table to a second temperature higher than the first temperature to process the substrate. The temperature of the substrate mounting table becomes the second temperature by allowing the refrigerant at a first flow rate to flow from the chiller to the refrigerant passage and operating the heater. The temperature of the substrate mounting table becomes the first temperature by allowing the refrigerant at a second flow rate larger than the first flow rate to flow from the chiller to the refrigerant passage and operating the heater, or stopping an operation of the heater.
A method of processing a substrate by a substrate processing apparatus comprising a substrate mounting table arranged in a process container and internally including a refrigerant passage through which a refrigerant flows and a heater, and a chiller configured to circulate the refrigerant with the refrigerant passage, the method comprising:
A substrate processing apparatus, comprising:
Dependencies are inferred from the claim text.