Wafer grinding apparatus and wafer grinding method
AssigneeMitsubishi Electric Corporation
InventorsNaoyuki TAKEDA, Kazunari NAKATA
Life of this patent
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Abstract
A wafer grinding apparatus performs grinding processing for grinding a semiconductor wafer with a grindstone. The grindstone has a wear rate as a characteristic. The wear rate is 5% or more, and less than 200%. A determination part performs determination processing for determining whether a grinding state with respect to the semiconductor wafer is abnormal or normal, based on at least one of a load current of a motor and a grinding wear amount.
Claims10
A wafer grinding apparatus that performs grinding processing for grinding a semiconductor wafer with a grindstone,
- wherein in the grinding processing, when a grinding amount is expressed as Kw, and a wear amount of the grindstone is expressed as Kt, the grinding amount being an. amount for grinding the semiconductor wafer with the grindstone, and the wear amount being planned to be generated by performing the grinding processing,
- the grindstone has, as a characteristic, a wear rate expressed by a formula of Kt/Kw,
- the wear rate is 5% or more, and less than 200%, and
- the wafer grinding apparatus comprises a determination part that performs determination processing for determining whether a grinding state with respect to the semiconductor wafer is abnormal or normal, based on at least one of
- (a) a load current of a motor for rotating the grindstone in the grinding processing, and (b) a grinding wear amount that is a wear amount of the grindstone generated by performing the grinding processing.
A wafer grinding method performed by a wafer grinding apparatus that performs grinding processing for grinding a semiconductor wafer with a grindstone,
- wherein in the grinding processing, when a grinding amount is expressed as Kw, and a wear amount of the grindstone is expressed as Kt, the grinding amount being an amount for grinding the semiconductor water with the grindstone, and the wear amount being planned to be generated by performing the grinding processing,
- the grindstone has, as a characteristic, a wear rate expressed by a formula of Kt/Kw,
- the wear rate is 5% or more, and less than 200%, and
- the wafer grinding method comprises
- a determination step of performing determination processing for determining whether a grinding state with respect to the semiconductor wafer is abnormal or normal, based on at least one of
- (a) a load current of a motor for rotating the grindstone in the grinding processing, and (b) a grinding wear amount that is a wear amount of the grindstone generated by performing the grinding processing.
Dependencies are inferred from the claim text.