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US 2019/0355594 A1Published application
Substrate processing apparatus
AssigneeEbara Corporation
InventorsHidetatsu ISOKAWA, Koji MAEDA, Xu HAIYANG, Shun EHARA
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Abstract
A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism.
Claims8
A substrate processing apparatus comprising:
- a substrate polishing device;
- and
- a substrate cleaning unit configured to clean a substrate polished by the substrate polishing device, wherein
- the substrate cleaning unit includes:
- a cleaning module configured to perform a cleaning of the substrate;
- and
- a cleaning unit conveyance mechanism configured to convey the substrate in the substrate cleaning unit,
- the cleaning unit conveyance mechanism includes:
- a hand configured to hold the substrate;
- and
- a hand open/close mechanism configured to open and close the hand,
- the substrate processing apparatus further includes a hand cleaning unit configured to clean the hand, and
- the hand cleaning unit includes:
- a hand cleaning tank disposed on a side portion of the cleaning module in a direction in which the hand opens and closes, the hand cleaning tank being configured to house the hand;
- and
- a cleaning liquid injection mechanism configured to inject a cleaning liquid toward a predetermined position when the hand is housed in the hand cleaning tank.
13 more elements
Dependencies are inferred from the claim text.